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Factory Introduction

XHX delivers full-service PCB/PCBA solutions with SMT and DIP expertise. We provide a turnkey production from prototype to mass scale, combining precision, speed, and scalability.

With 15+ years’ experience, our team guides clients through seamless development to successful launch. Our facilities feature 14 high-speed SMT lines, 5 wave soldering lines, please with 4 testing lines and dedicated box build assembly, with ongoing expansions to meet customers’ demand.

ISO 9001, ISO14001,ISO 13485, and ITAF16949 certifications demonstrate our commitment to quality, cost-effective manufacturing, and superior customer support.

PCB Assembly Capabilities

We offer a diverse range of options for printed circuit board assembly, including Surface Mount Technology (SMT), Dual In-line Package(DIP), Manual Insertion (MI), and Auto-Insertion (AI). We are also equipped to meet RoHS/Lead-free requirements. Our flexibility extends to component formats, supporting Reel, Cut-tapes, and Tray formats to cater to our customers’ specific needs.

Items	Information
PCB Board Type	Rigid PCB, Rigid-Flex PCB, FPC,Ceramic PCB, IMS PCB
PCB Board Thickness	0.1mm(min), 8mm(max)
PCB Panel Size	50mm50mm(min), 610mm460mm(max)
SMT Component Size Range	01005(min), 55mm100mm28mm(max)
SMT Component Pitch Range	≥0.35mm
SMT Component Package	Reel, Cut Tape, Tube, Tray, or Bulk Packaging. Loose parts are manually loaded by experienced operators when necessary.
SMT Component Source	Consigned/Kitted(You provided all components), Turnkey(XHX provide all components), Partial Turnkey(You provide the main and expensive components, XHX provide the rest)
SMT Repeat Accuracy	±0.025mm
DIP Component Size Range	Height of component<120mm
Protective N2 Gas Purity Of SMT&DIP	99.999%
Testing & Inspection	Every PCBA undergoes 3D AOI, SPI, X-Ray, Flying Probe, ICT, and Functional Testing (FCT) after program burning. Full traceability through MES ensures zero-defect quality control.
Repair & Rework	We offer BGA reballing, component rework, and repair services using precise rework stations and X-ray alignment. This ensures cost-effective recovery of high-value boards.
Box Build Assembly	we provide box build and system integration services, including mechanical assembly, cable harnessing, testing, labeling, and packaging, enabling true end-to-end delivery.
Min Order	1 PCS is available

SMT

IQC

IQC in PCBA inspects incoming components and materials for defects, compliance, and functionality before assembly. It prevents defects, reduces rework, and ensures reliability by verifying specs, dimensions, and electrical performance.

PCB cleaning

Before applying solder paste, PCBs must be thoroughly cleaned to ensure optimal stencil printing and soldering quality. Contaminants like dust, oils, oxidation, or residual flux can cause poor paste adhesion, misprints, or soldering defects.

Laser Marking

Solder paste printer

A solder paste printer is a critical PCB Assembly machine that accurately deposits solder paste onto PCB pads before component placement. It ensures precise, consistent application for strong electrical connections during reflow soldering.

3D-SPI

3D-SPI is an advanced inspection system in PCBA to verify the quality, volume, and alignment of solder paste deposits after printing but before component placement. It ensures defect-free soldering and prevents reflow issues

Pick and Place

Mounting (or component placement) is the process of accurately positioning and attaching electronic components onto a PCB after solder paste application. Mounting is a foundational step in PCBA, directly impacting soldering quality and final product reliability

FAI

FAI (First Article Inspection) is a critical quality control process performed on the first batch of assembled PCBs to verify that the manufacturing process meets design specifications before full-scale production.

2D-AOI

2D-AOI (Automated Optical Inspection) before reflow is a critical quality checkpoint in the SMT assembly process. It inspects the PCB after solder paste printing and component placement, but before the board enters the reflow oven.

Reflow oven

Reflow oven can melt solder paste to permanently attach components to a PCB. It applies controlled heat to follow a precise temperature profile, ensuring reliable solder joints without damaging components.

3D-AOI

3D-AOI (3D Automated Optical Inspection) is a post-reflow inspection system that uses structured light, lasers, or multi-angle cameras to scan solder joints and components in three dimensions, detecting defects that 2D-AOI might miss.

X-ray

An X-ray inspection machine is a non-destructive testing (NDT) system used to examine hidden solder joints, internal PCB layers, and complex components that optical inspection cannot detect.

DIP/THT

IQC

Press-fit DIP components create solderless connections via interference fit, ideal for harsh environments. The compliant pins form gas-tight joints through elastic deformation, requiring precise PCB holes but eliminating thermal soldering stress.

Component Shape

DIP preprocessing steps: Capture → Denoise (median/NLM) → Enhance (CLAHE) → Detect edges (Canny) → Segment (Otsu) → Analyze defects. Optimizes inspection of pins and solder joints.

Component insertion

DIP insertion aligns pins with PCB holes manually or automatically, ensuring proper seating and straight pins. Automated systems apply 1-5N/pin force; manual needs visual checks. Done after SMT to avoid thermal issues.

2D-AOI

2D-AOI inspection after DIP component insertion checks for proper placement, verifying all components are present, correctly oriented, and fully seated with straight pins, while detecting any physical defects or misalignments before soldering to ensure assembly quality.

Automatic wave soldering

Automatic wave soldering for DIP components applies flux, preheats the PCB, then passes it over a molten solder wave to form reliable through-hole connections, with conveyor speed and wave height tightly controlled to prevent bridging or cold joints.

Automatic selective wave soldering

Selective wave soldering targets through-hole parts with localized flux and mini-wave nozzles, protecting nearby SMT components. This efficient process minimizes waste and ensures reliable DIP connections on mixed-technology boards.

Cleaning machine

Cleaning machine removes flux residues and contaminants to ensure reliability after wave soldering, and prevents long-term corrosion and electrical failures in DIP assemblies.

2D-AOI

2D-AOI after wave soldering checks DIP solder joints for defects. It identifies bridges, insufficient/excess solder, and poor wetting using top-down imaging with diffused lighting. This automated inspection catches critical soldering issues before electrical testing.

De-paneling

Separates individual boards from production panels after DIP assembly. V-Scoring/Punching for simple breakaway designs. Router cutting for precise, dust-free separation. Laser Cutting for high-precision for fragile boards.

Final DIP assembly QA involves visual, automated, and functional testing. Inspectors check component placement, solder quality, and electrical performance, including pin alignment, solder fillets, and thermal integrity. All results are documented to ensure 100% functional units before shipment

Program Buring & Testing

Program

ICT Test

FCT Test

PCBA packaging customization

Unconventional form factors

Some PCBs or PCBA components have unconventional form factors that standard packaging can’t accommodate, requiring custom solutions for proper protection and handling.

Protection against vibration

PCBs and PCBA components can be damaged by shocks and vibrations during transit or operation. Custom packaging with shock-absorbing materials, cushioning, or anti-vibration mounts ensures protection.

Integration with enclosures

Some PCBs and PCBA components require seamless integration into larger systems. Custom packaging ensures proper fit, alignment, and compatibility with enclosure dimensions, mounting needs, and interfaces.

Compliance with industry standards

Certain industries, like aerospace, military, and medical, have strict packaging standards for safety and compliance. Custom solutions ensure durability, reliability, and adherence to these requirements.

Environmental requirements

PCBs and PCBA components may require environmentally protective packaging—featuring thermal insulation, moisture barriers, or chemical resistance—to withstand harsh conditions.

traceability requirements

Some PCB/PCBA applications require traceability. Custom packaging can integrate tracking technologies for provenance, quality control, and easier fault diagnosis or recalls.

Certification Certificate

Utility Model Patent Certificate

Specialized and innovative small and medium-sized enterprises

Innovative small and medium-sized enterprises

ISO9001-20015-CN

FAQ

Do you have Quick Turn PCB Assembly service?

Yes, we do. The fastest lead-time is 3wds.

Do you offer RoHS-compliant assemblies?

Yes, we do.

Can I provide the components for the assembly?

Yes, you can provide the components in a tray or bag that is clearly marked with the part numbers from your BOM. But, please take care to protect the components during transit.

Please contact us to understand how the components can be supplied.

What are the testing services provided by you?

We provide comprehensive testing services for PCBs, ensuring their quality and functionality throughout the assembly process. Our testing includes:

AOI Testing.
X-ray Testing.
In-Circuit Testing.

What is a turnkey order?

A turnkey order refers to a service where we take care of the entire PCB assembly process for the customer. This includes sourcing and procuring all the necessary components, manufacturing the circuit boards, performing the assembly, conducting testing and inspection, and finally delivering the finished product to the customer. We offer two types of turnkey assembly services:

Full Turnkey: We handle everything from start to finish. We procure all the required parts, assemble the PCBs, perform thorough testing and inspection, and ship the completed product directly to your designated location.

Partial Turnkey: In this option, you provide us with the necessary circuit boards and components, and we take care of the assembly, testing, and inspection. Once the PCBs are ready, we ship them to you.

These turnkey services provide a convenient and comprehensive solution, ensuring a smooth and efficient PCB assembly process for our customers.

What documentation or files are required for a turnkey assembly?

Gerber files that include top and bottom silkscreen and solder paste layers.
The Centroid data file which contains rotations, component locations, and reference designators.
BOM (.xls) with vendor names, quantities, reference designators, part and package descriptions, and quantities.
Types of components, including SMT, through-hole, fine pitch, BGA, and more.
Any additional instructions and requirements.

These documents and files are essential to ensure a smooth process for turnkey assembly.